Produttore: Aries Electronics
Serie: Lo-PRO®file, 526
Pacchetto: Bulk
Stato del prodotto: Active
Tipo: DIP, ZIF (ZIP)
Numero di posizioni o pin (griglia): 40 (2 x 20)
Pitch - Accoppiamento: 0.100\ (2.54mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 10.0碌in (0.25碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 10.0碌in (0.25碌m) Contact Material - Post: Beryllium Copper Housing Material: Polyamide (PA46)
