Produttore: Aries Electronics
Serie: 8
Pacchetto: Bulk
Stato del prodotto: Active
Tipo: DIP, 0.6\ (15.24mm) Row Spacing Number of Positions or Pins (Grid): 18 (2 x 9) Pitch - Mating: 0.100\ (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0碌in (0.76碌m) Contact Material - Mating: Beryllium Copper Mounting Type: Through Hole Features: Closed Frame Elevated Termination: Solder Pitch - Post: 0.100\ (2.54mm) Contact Finish - Post: Gold
